[Clean & Pack] Round Wire Coil Spring - O.D. Referenced, Stainless Steel, UM/UH
Brand :
MISUMI
Caution
- Cleaning also removes rust prevention oil, which may make the product more susceptible to rusting than an uncleaned product.
Please be careful about the application location and storage environment.
Product Description
Three types of cleaning methods are available: degreasing, precision cleaning, and electrolytic polishing + precision cleaning. They can be ordered from one piece with the standard part number.
This eliminates the need for customer cleaning or outsourced cleaning, reducing the amount of time and effort required.
This eliminates the need for customer cleaning or outsourced cleaning, reducing the amount of time and effort required.
■Part Number for Clean & Pack Products
| ·Degreasing (Anti-rust single packing) | : Part Number SL-□□ |
| ·Precision cleaning (Degassing double packing) | : Part Number SH-□□ |
| ·Electrolytic polishing + precision cleaning (Degassing double packing) | : Part Number SHD-□□ |
| Product Part Number | Cleaning Method | Packaging Type | Effects Compared to Uncleaned Product | Environment (Standard) | Process |
| SL-□□ | Degreasing | Anti-rust packing | Oil removal | General environment | Regular assembly process |
| Post battery assembly process | |||||
| SH-□□ | Precision cleaning | Degassing double packing | Oil removal Dust removal | Clean environment (Class 10 to 1,000) | Battery assembly process |
| LCD-related post assembly process | |||||
| In-vehicle camera assembly process | |||||
| SHD-□□ | Electrolytic polishing + precision cleaning | Degassing double packing | Oil removal Dust removal Outgas reduction | Vacuum environment Clean environment (Class 10 to 1,000) | Pre-semiconductor process |
| Liquid crystal deposition process | |||||
| Pre-OLED process |
■Notes
Cleaning also removes rust prevention oil, which may make the product more susceptible to rusting than an uncleaned product.
Please be careful about the application location and storage environment.
Cleaning also removes rust prevention oil, which may make the product more susceptible to rusting than an uncleaned product.
Please be careful about the application location and storage environment.
Three types of cleaning methods are available: degreasing, precision cleaning, and electrolytic polishing + precision cleaning. They can be ordered from one piece with the standard part number.
This eliminates the need for customer cleaning or outsourced cleaning, reducing the amount of time and effort required.
This eliminates the need for customer cleaning or outsourced cleaning, reducing the amount of time and effort required.
■Part Number for Clean & Pack Products
| ·Degreasing (Anti-rust single packing) | : Part Number SL-□□ |
| ·Precision cleaning (Degassing double packing) | : Part Number SH-□□ |
| ·Electrolytic polishing + precision cleaning (Degassing double packing) | : Part Number SHD-□□ |
| Product Part Number | Cleaning Method | Packaging Type | Effects Compared to Uncleaned Product | Environment (Standard) | Process |
| SL-□□ | Degreasing | Anti-rust packing | Oil removal | General environment | Regular assembly process |
| Post battery assembly process | |||||
| SH-□□ | Precision cleaning | Degassing double packing | Oil removal Dust removal | Clean environment (Class 10 to 1,000) | Battery assembly process |
| LCD-related post assembly process | |||||
| In-vehicle camera assembly process | |||||
| SHD-□□ | Electrolytic polishing + precision cleaning | Degassing double packing | Oil removal Dust removal Outgas reduction | Vacuum environment Clean environment (Class 10 to 1,000) | Pre-semiconductor process |
| Liquid crystal deposition process | |||||
| Pre-OLED process |
■Notes
Cleaning also removes rust prevention oil, which may make the product more susceptible to rusting than an uncleaned product.
Please be careful about the application location and storage environment.
Cleaning also removes rust prevention oil, which may make the product more susceptible to rusting than an uncleaned product.
Please be careful about the application location and storage environment.