MicroClasp® 2.0 mm Pitch Circuit Board Wafer (55959)
Brand :
MOLEX
Caution
Product Description
[Features]
A space-saving Molex product that offers easier removal than other similar 2.00 mm (.079") and 2.50 mm (.098") pitch wire-to-circuit board connection systems. Angle type (mating housing: 51353).
MicroClasp® 2.0 mm Pitch Circuit Board Wafer (55959)
Reference product image, part number: 55959-0830
Features
· Category: PCB Headers
· Series: 55959
· Application: Signal, Wire-to-Board
· Number of pins: 8 - 40
· Allowable current: 3.0A
· Allowable voltage: 250V
· Temperature Range - Operating: -40 to +105°C
Dimensions
Dimensional drawing
| Number of Pins | Part Number | Dimension A | Dimension B | Dimension C |
|---|---|---|---|---|
| 8 | 55959-0830 | 11.4 | 6.8 | 9.8 |
| 10 | 55959-1030 | 13.4 | 8.0 | 11.8 |
| 12 | 55959-1230 | 15.4 | 10.0 | 13.8 |
| 14 | 55959-1430 | 17.4 | 12.0 | 15.8 |
| 16 | 55959-1630 | 19.4 | 14.0 | 17.8 |
| 18 | 55959-1830 | 21.4 | 16.0 | 19.8 |
| 20 | 55959-2030 | 23.4 | 18.0 | 21.8 |
| 22 | 55959-2230 | 25.7 | 20.0 | 23.8 |
| 24 | 55959-2430 | 27.4 | 22.0 | 25.8 |
| 26 | 55959-2630 | 29.4 | 24.0 | 27.8 |
| 28 | 55959-2830 | 31.4 | 26.0 | 29.8 |
| 30 | 55959-3030 | 33.4 | 28.0 | 31.8 |
| 32 | 55959-3230 | 35.4 | 30.0 | 33.8 |
| 34 | 55959-3430 | 37.4 | 32.0 | 35.8 |
| 36 | 55959-3630 | 39.4 | 34.0 | 37.8 |
| 38 | 55959-3830 | 41.4 | 36.0 | 39.8 |
| 40 | 55959-4030 | 43.4 | 38.0 | 41.8 |
Fitting Diagram
Fitting diagram
Mating partners
55959 · 51353 · 56134
H = 11.7 mm
W = 17.95 mm
55959 · 51353 · 56134
H = 11.7 mm
W = 17.95 mm