PLC MELSEC iQ-F FX5UC Series Sequencer CPU

Brand :

MITSUBISHI

Caution

Product Description

- PLC MELSEC iQ-F FX5UC series by Mitsubishi electric.
- Save space by eliminating the need for a terminal block.
- Device information can be shared with simple parameter settings, so the programming man-hours can be reduced.
- View the system status even from a remote location.
- Prevents data theft, tampering, misoperation, illegal execution, etc. caused by unauthorized access from a third party with the security functions.
- Information can be saved to the SD memory card periodically from the computer and network equipment.

MELSEC iQ-F FX5UC Series Sequencer CPU Specifications

FX5UC-32MT/D

FX5UC-32MT/D image

CPU performance

The sequence execution engine, which is the heart of the MELSEC iQ-F, is a newly developed execution engine supporting structured programs, execution of multiple programs, ST language, FB, etc.

Control scale: up to 512 points

When remote I/Os (CC-Link, AnyWireASLINK or Bitty Series) are used, up to 512 points can be controlled.

Built-in positioning (200 kHz, built-in 4 axes)

A positioning function based on pulse outputs from the 4 axes, is provided.
You can also set the table method and use applied commands corresponding to the interruption, variable speed operation and simple interpolation functions.

Simple motion unit can be connected.

By connecting the simple motion unit, SSCNET III/H-compatible positioning becomes possible.
You can create table-method programs combining linear interpolation, 2‑axis arc interpolation and continuous path control to draw smooth paths with ease.

Built-in Ethernet port

The Ethernet communication port supports communication up to 8 connections on the network, permitting connection with many personal computers and equipment. It also supports remote maintenance and seamless SLMP communication with host equipment, etc.

Built-in RS-485 port (with MODBUS function)

The built-in RS-485 communication port enables communication with up to 16 Mitsubishi general-purpose inverters over a distance of up to 50 m. (The inverters can be controlled using 6 applied commands.)
The port also supports the MODBUS function, permitting connection with up to 32 peripherals (including the master) such as sequencers, sensors and temperature control units.

Built-in SD card slot

The built-in SD card slot is useful when updating programs or in mass production of equipment.
You will be able to save data logs in an SD card (future function) for use in the analysis of equipment status, production condition, etc.

High-speed system bus communication

The MELSEC iQ-F, together with a high-speed CPU, achieves high-speed system bus communication of 1.5k word/ms (approx. 150 times faster than the level achievable with the FX3U), to demonstrate its full capability even when intelligent function units generating a lot of data traffic are used.

RUN/STOP/RESET switches

The RUN/STOP switch now has a RESET function.
This increases the debugging efficiency because the system can be restarted without turning off the main power.

Security

The MELSEC iQ-F provides security functions (file password, remote password, security key) that are designed to prevent data theft, unauthorized operation, etc., by third parties making illegal access.

No battery, maintenance-free

You can save programs without using a battery. Clock data is saved for 10 days using a large-capacity capacitor (the specific period varies depending on the use condition).

* You can use an optional battery unit to save (latch) the clock data and device memory in the event of power failure.

FX5UC-32MT/D Performance Specifications

Number Of Devices
Control Method			Stored Program Repeating Operation
Input/Output Control Method			Refresh Method (Direct access input/output is possible by specifying the direct access input/output (DX, DY).)
Programming Specification	Programming Language		Ladder Diagram (LD), Structured Text (ST), Function Block Diagram / Ladder Language (FBD/LD)
	Programming Expansion Function		Function Block (FB), Structured Ladder, Label Programming (Local/Global)
	Constant Scan		0.2 to 2,000 ms (can be set in 0.1 ms intervals)
	Periodic Interrupt		1 to 60,000 ms (can be set in 1 ms intervals)
	Timer Performance Specification		100 ms, 10 ms, 1 ms
	Program Execution Capacity		32 pcs
	FB File Capacity		16 files (including up to 15 user files)
Operation Specification	Execution Type		Standby type, initial execution type, scan execution type, periodic execution type, event execution type
Operation Specification	Interrupt Type		Internal timer interrupt, input interrupt, high-speed comparison & match interrupt, interrupt from unit
Command Processing Time	LD X0		34 ns
Command Processing Time	MOV D0 D1		34 ns
Memory Capacity	Program Capacity		64k steps (128 KB, flash memory)
	SD Memory Card		Memory Card Capacity (SD/SDHC memory card: up to 16 GB)
	Device / Label Memory		120 KB
	Data Memory / Standard ROM		5 MB
Number Of Writes To Flash Memory (Flash ROM)			Maximum 20,000 writes
Maximum File Storage Capacity	Device / Label Memory		1
	Data Memory	P: Program File Capacity	32 pcs
	Data Memory	FB: FB File Capacity	16 pcs
	SD Memory Card	2 GB	511 Storage capacity in the root folder.
	SD Memory Card	4 GB, 8 GB, 16 GB	65,534 Storage capacity in the root folder.
Clock Function	Displayed Information		Year, month, day, hour, minutes, seconds, day of the week (Leap years are automatically detected.)
Clock Function	Accuracy		Monthly difference ±45 sec / 25°C (TYP)
Number Of Inputs/Outputs	(1) Number Of Inputs/Outputs		256 points or less
	(2) Number Of Remote I/Os		384 points or less
	Total Points Of (1) And (2)		512 points or less
Retention Upon Power Failure (Clock Data)	Retention Method		Large capacitor Clock data is retained using the power stored in the large capacitor built in the sequencer. Clock data is not retained correctly if the voltage of the large capacitor drops. In a fully-charged state (power has been supplied to the sequencer for at least 30 minutes), the data can be stored for 10 days using the capacitor (ambient temperature: 25°C). The storage period using the capacitor varies depending on the ambient operating temperature. The higher the ambient operating temperature, the shorter the retention period.
Retention Upon Power Failure (Clock Data)	Retention Period		10 days (Ambient temperature: 25°C)
Retention Upon Power Failure (Device)	Retention Capacity Upon Power Failure		Up to 12k words All devices in the device (high speed) area can be retained upon power failure. If a battery unit is used, the devices in the device (standard) area can also be retained.
Number Of User Devices	Input Relay (X)	Octal	1,024 points The total number of X and Y points assigned to inputs and outputs, is no more than 256.
	Output Relay (Y)	Octal	1,024 points The total number of X and Y points assigned to inputs and outputs, is no more than 256.
	Internal Relay (M)	Decimal	32,768 points (can be changed using parameters) Can be changed using parameters within the CPU built-in memory capacity range.
	Latch Relay (L)	Decimal	32,768 points (can be changed using parameters) Can be changed using parameters within the CPU built-in memory capacity range.
	Link Relay (B)	Hexadecimal	32,768 points (can be changed using parameters) Can be changed using parameters within the CPU built-in memory capacity range.
	Annunciator (F)	Decimal	32,768 points (can be changed using parameters) Can be changed using parameters within the CPU built-in memory capacity range.
	Link Special Relay (SB)	Hexadecimal	32,768 points (can be changed using parameters) Can be changed using parameters within the CPU built-in memory capacity range.
	Step Relay (S)	Decimal	4,096 points (fixed)
	Timer (Timer (T))	Decimal	1,024 points (can be changed using parameters) Can be changed using parameters within the CPU built-in memory capacity range.
	Integration Timer (Integration Timer (ST))	Decimal	1,024 points (can be changed using parameters) Can be changed using parameters within the CPU built-in memory capacity range.
	Counter (Counter (C))	Decimal	1,024 points (can be changed using parameters) Can be changed using parameters within the CPU built-in memory capacity range.
	Counter (Counter (LC))	Decimal	1,024 points (can be changed using parameters) Can be changed using parameters within the CPU built-in memory capacity range.
	Data Register (D)	Decimal	8,000 points (can be changed with a parameter) The value can be changed with a parameter within the range permitted by the capacity of the built-in CPU memory.
	Link Register (W)	Hexadecimal	32,768 points (can be changed using parameters) Can be changed using parameters within the CPU built-in memory capacity range.
	Link Special Register (SW)	Hexadecimal	32,768 points (can be changed using parameters) Can be changed using parameters within the CPU built-in memory capacity range.
Number Of System Devices	Special Relay (SM)	Decimal	10,000 points (fixed)
Number Of System Devices	Special Register (SD)	Decimal	12,000 points (fixed)
Unit Access Device	Intelligent Function Unit Device	Decimal	65,536 points (specified by U□¥G□)
Number Of Index Registers	Index Register (Z)	Decimal	24 points Index registers (Z) and long index registers (LZ) can be set for a total of 24 words or less.
Number Of Index Registers	Long Index Register (LZ)	Decimal	12 points Index registers (Z) and long index registers (LZ) can be set for a total of 24 words or less.
Number Of File Registers	File Register (R)	Decimal	32,768 points (can be changed using parameters) Can be changed using parameters within the CPU built-in memory capacity range.
Number Of Nestings	Nesting (N)	Decimal	15 points (fixed)
Number Of Pointers	Pointer (P)	Decimal	4,096 points
Number Of Pointers	Interrupt Pointer (I)	Decimal	178 points (fixed)
Other	Decimal Constant (K)	Signed	16 bits: -32,768 to +32767 32 bits: -2,147,483,648 to +2,147,483,647
	Decimal Constant (K)	Unsigned	16 bits: 0 to 65,535 32 bits: 0 to 4,294,967,295
	Hexadecimal Constant (H)		16 bits: 0 to FFFF 32 bits: 0 to FFFFFFFF
	Real Constant (E)	Single Precision	E-3.40,282,347+38 to E-1.17,549,435-38, 0, E1.17,549,435-38 to E3.40,282,347+38
	Character String		Shift JIS code, up to 255 single-byte characters (256 characters including NULL)
Power Supply Specification
Power Supply Voltage			24 V DC
Voltage Fluctuation Range			+20%, -15%
Allowable Momentary Power Outage Duration			Operation will continue following a momentary power outage of 5 ms or less.
Power Supply Fuse			125 V 3.15 A Time Lag Fuse
Inrush Current			Max. 35 A for 0.5 ms or less / 24 V DC
Power Consumption			5 W / 24 V DC [30 W / 24 V DC + 20%, -15%] The value assumes that the CPU unit is used alone. The value in [ ] assumes a configuration based on the maximum allowable connections to the CPU unit. (Any external 24‑V DC power supply for expanded equipment is not included.)
5 V DC Power Supply Capacity			720 mA
24‑V DC Power Capacity			500 mA
Input Specification
Number Of Input Points			16 points
Input Connection Format			Connector
Input Format			Sink
Input Signal Voltage			24 V DC +20%, -15%
Input Signal Current	X000 to X017		5.3 mA / 24 V DC
Input Impedance	X000 to X017		4.3 kΩ
Input ON Sensing Current	X000 to X017		3.5 mA or more
Input OFF Sensing Current			1.5 mA or less
Input Response Frequency	X000 to X005		200 kHz Refer to the MELSEC iQ-F FX5UC User’s Manual (Hardware) for details on importing pulses of response frequencies between 50 kHz and 200 kHz.
Input Response Frequency	X006 to X017		10 kHz
Input Response Time (H/W Filter Delay)	X000 to X005		ON: 2.5 μs or less OFF: 2.5 μs or less
Input Response Time (H/W Filter Delay)	X006 to X017		ON: 30 μs or less OFF: 50 μs or less
Input Response Time (Digital Filter Setting Value)			None, 10 μs, 50 μs, 0.1 ms, 0.2 ms, 0.4 ms, 0.6 ms, 1 ms, 5 ms, 10 ms (default), 20 ms, 70 ms If the use environment is subject to a lot of noise, set a digital filter.
Input Signal Format			Non-voltage Contact Input NPN Open Collector Transistor
Input Circuit Insulation			Photocoupler Insulation
Input Operation Indicator			The LED is lit when the input is ON. (DISP switch IN side)
Output Specification
Number Of Outputs			16 points
Output Connection Format			Connector
Output Type / Format			Transistor / Sink Output
External Power Supply			5 to 30 V DC
Maximum Load	Y000 to Y003		0.3 A/point See below for the total load current per common. output 8 point/common: 0.8 A or less (1.6 A or less if two common terminals are connected externally)
Maximum Load	Y004 Or Later		0.1 A/point See below for the total load current per common. output 8 point/common: 0.8 A or less (1.6 A or less if two common terminals are connected externally)
Leakage Current When Open			0.1 mA or less / 30 V DC
Voltage Drop In ON State	Y000 to Y003		1.0 V or less
Voltage Drop In ON State	Y004 or later		1.5 V or less
Response Time	Y000 to Y003		2.5 μs or less / 10 mA or more (5 to 24 V DC)
Response Time	Y004 or later		0.2 ms or less / 100 mA (24 V DC)
Output Circuit Insulation			Photocoupler Insulation
Output Operation Indicator			The LED is lit when the output is ON. (DISP switch OUT side)

FX5UC-32MT/D Function Specifications

Scan Monitor Function (Watchdog Timer Setting)		The scan time is monitored to detect CPU unit hardware and program errors.
Clock Function		This function can be used for time management relating to date-stamping of error history and other system functions.
Runtime Write	Runtime Circuit Block Change	Portions edited on the ladder editing screen of the engineering tool are written to the CPU unit for each circuit. Edited items that apply to multiple locations can be written to the CPU unit all at once.
Interrupt Function	Multiple Interrupt Function	Assume that, when an interrupt program is running, an interrupt due to a different reason occurs. In this case, the program of the lower priority is interrupted, and the program of the higher priority, whose running conditions are satisfied, is run.
PID Control Function		PID control is performed using PID control commands.
Constant Scan		A program is run repeatedly while maintaining a constant scan time.
Remote Operation	Remote RUN/STOP	While keeping the RUN/STOP/RESET switch on the CPU unit at the RUN position, the CPU unit is changed to the RUN/STOP/PAUSE state externally.
	Remote PAUSE	While keeping the RUN/STOP/RESET switch on the CPU unit at the RUN position, the CPU unit is changed to the RUN/STOP/PAUSE state externally.
	Remote RESET	When the CPU unit is in the STOP state, an external operation is performed to reset the CPU unit.
Device / Label Memory Area Setting		The capacity of each device / label memory area is set.
Default Device Settings		The devices used by a program is set without using program.
Latch Function		The CPU unit settings for devices/labels are retained after a power outage, or even when the power is turned off and then turned back on.
Memory Card Function	SD Memory Card Abort	Even when a function that uses an SD memory card is running, use of the SD memory card can be stopped without turning off the power.
Memory Card Function	Boot Operation	The files stored in the SD memory card are transferred to the transfer destination memory automatically determined by the CPU unit, when the CPU unit power is turned off and then turned back on or the CPU unit is reset.
Device / Label Access Service Processing Setting		The number of times the device / label access service processing is implemented as part of the end processing, is set by a parameter.
RAS Function	Self-Diagnostic Function	The CPU unit diagnoses itself for error.
RAS Function	Error Reset	All present errors are reset at once.
Security Function		The customer’s assets saved to the personal computer or FX5 system unit is protected against theft, falsification, mis-operation, unauthorized execution, etc., by third parties making illegal access.
Built-In I/O Functions	High-Speed Counter Function	Inputs to the CPU unit can be used to perform high-speed counter operation, pulse width measurement, input interrupt, timer interrupt, high-speed counter interrupt, etc.
	Pulse Width Measurement Function	Inputs to the CPU unit can be used to perform high-speed counter operation, pulse width measurement, input interrupt, timer interrupt, high-speed counter interrupt, etc.
	Input Interrupt Function	Inputs to the CPU unit can be used to perform high-speed counter operation, pulse width measurement, input interrupt, timer interrupt, high-speed counter interrupt, etc.
	Timer Interrupt Function	Inputs to the CPU unit can be used to perform high-speed counter operation, pulse width measurement, input interrupt, timer interrupt, high-speed counter interrupt, etc.
	High-Speed Counter Interrupt Function	Inputs to the CPU unit can be used to perform high-speed counter operation, pulse width measurement, input interrupt, timer interrupt, high-speed counter interrupt, etc.
	Built-In Positioning Function	Transistor outputs from the CPU unit can be used to perform positioning operations for up to 4 axes.
	PWM Output Function	Transistor outputs from the CPU unit can be used to generate PWM outputs.
Built-In Ethernet Function		Ethernet-related functions such as connecting the MELSOFT product and GOT, and socket communication.
Serial Communication Function		Serial communication-related functions such as simple links between personal computers, MC protocol, inverter communication function and non-procedural communication.
MODBUS RTU Communication Function		MODBUS RTU-compatible products can be connected. Master/slave function can be used.

FX5UC-32MT/D General Specifications

Ambient Operating Temperature			-20 to 55°C, assuming no icing Subject to input/output derating. For details, refer to the MELSEC iQ-F FX5UC User’s Manual (Hardware). 0 to 55°C for products manufactured before June 2016. For an intelligent function unit, refer to the manual for each product. The following equipment cannot be used at an ambient temperature below 0°C: FX5-40SSC-S, FX5-CNV-BUS, FX5-CNV-BUSC, Battery (FX3U-32BL), SD memory card (NZ1MEM-2GBSD, NZ1MEM-4GBSD, NZ1MEM-8GBSD, NZ1MEM-16GBSD, L1MEM-2GBSD, L1MEM-4GBSD), FX3 Extension Unit, Terminal Unit, I/O Cable (FX-16E-500CAB-S, FX-16E-□CAB, FX-16E-□CAB-R) The specifications vary if used in an environment below 0°C. For details, refer to the MELSEC iQ-F FX5UC User’s Manual (Hardware).
Ambient Storage Temperature			-25 to 75°C, assuming no icing
Ambient Operating Humidity			5 to 95% RH, assuming no condensation If the product is used in a low-temperature environment, make sure sudden temperature shift does not occur. If sudden temperature shift occurs due to opening/closing of the control panel, etc., condensation may occur and cause fire, failure or malfunction. Also, provide air-conditioning to dehumidify the air to prevent condensation.
Ambient Storage Humidity			5 to 95% RH, assuming no condensation
Vibration Resistance	When Mounting To DIN Rail	Frequency: 5 To 8.4 Hz	Single amplitude: 1.75 mm 10 times in each direction of X, Y and Z (total 80 minutes each) Judgment criteria are based on IEC61131-2.
Vibration Resistance	When Mounting To DIN Rail	Frequency: 8.4 To 150 Hz	Acceleration: 4.9 m/s² 10 times in each direction of X, Y and Z (total 80 minutes each) Judgment criteria are based on IEC61131-2.
Impact Resistance			147 m/s², for a duration of 11 ms, three times in each two-way direction of X, Y and Z with a half-sine pulse The judgment criteria shall conform to IEC61131-2.
Noise Resistance			Achieved through a noise simulator with a noise voltage of 1,000 Vp-p, noise width of 1 μs and frequency of 30 to 100 Hz
Withstand Voltage	Between Power Supply Terminal (24 V DC) And Earth Terminal		500 V AC for 1 min
	Between Input Terminal (24 V DC) And Earth Terminal		500 V AC for 1 min
	Between Output Terminal (Transistor) And Earth Terminal		500 V AC for 1 min
Insulation Resistance	Between Power Supply Terminal (24 V DC) And Earth Terminal		10 MΩ or more at 500 V DC on an insulation resistance meter
	Between Input Terminal (24 V DC) And Earth Terminal		10 MΩ or more at 500 V DC on an insulation resistance meter
	Between Output Terminal (Transistor) And Earth Terminal		10 MΩ or more at 500 V DC on an insulation resistance meter
Earthing			Class D earthing (earthing resistance: 100 Ω or less) <No common earthing with a strong magnetic system> <Precaution> · Provide dedicated earthing whenever possible. If dedicated earthing cannot be provided, use common earthing. (Refer to the manual for details.) · Provide an earthing point as close as possible to the sequencer to shorten the length of the earthing wire.
Operating Atmosphere			There shall be no corrosion gas or flammable gas and not much conductive dust.
Operating Altitude			0 to 2,000 m Cannot be used in a pressurized environment of atmospheric pressure or higher. Failures may occur.
Installation Location			Inside the control panel
Overvoltage Category			II or lower Indicates the assumed power distribution point to which the applicable equipment is connected between the public power distribution network and the mechanical system in plant. Category II applies to the equipment to which power is supplied from a fixed facility. The surge resistance voltage of equipment of up to 300 V in rating is 2,500 V.
Pollution Degree			2 or lower Index to indicate the degree of conductive material generation in the environment in which the applicable equipment is used. Pollution degree 2 indicates that only non-conductive contaminants will generate. In this environment, however, temporary conduction may occur due to accidental condensation.
Equipment Class			Class 2

* See the catalog for model numbers other than those detailed above.