Laser S1 Cutter 105

[Features]
· Has the highest cutting speed level in the industry.
· Hardened board: Board has been heat treated to increase board strength.
· New wave substrate: Increased rigidity with wave shape of quenched substrate.
· Laser welding: Improves the strength of the joints by laser welding chips and circuit boards.
· High strength glue: Adopts a newly developed glue to have a strong tip even if the blade is thin.
· Turbo-tip: The area of contact with the workpiece is small, cutting resistance is suppressed, and sharpness is improved. The sharpness of the blade is maintained stably by preventing the diamond layer from overheating and by clearing the cut chips.
· Diagonal slits: The ejection effect on cutting chips prevents heat accumulation in the diamond layer, and the cutting ability is maintained stably.